1066 MHz memory modules have the great overclocking capability, superior compatibility and stability gamers need to get the most out of their systems. In addition, it reflects Apacer's long-term commitment and continuous efforts to provide the best solutions for gaming enthusiasts.

Apacer's Overclocking Series memory modules use only top quality DRAM chips, which are specially supported by major IC manufactures. These top quality DRAM chips combine with Apacer's outstanding PCB layout and design to provide the best performance with minimum interference. Strict manufacturing control and relentless quality control and testing meet the most rigorous performance standards to deliver cutting-edge Overclocking Series memory modules. In addition, as PC performance increases, thermal management becomes increasingly important. Apacer specially adopts an oversized, high-performance, extruded aluminum heatsink for its DDR2 1066 MHz modules. The massive spreader is able to absorb more heat, and quickly remove this heat. It is another reason why Apacer's DDR2 1066 MHz modules have the excellent stability while overclocking.

According to the Senior Director of Apacer's DRAM department, Ms. Grace Lo, Apacer is continuing to focus heavily on the gaming and overclocking market. Apacer has developed and will develop new products that satisfy gamers' needs for performance and stability. She further adds that Apacer was the only official memory supplier for the World Cyber Games 2006 (WCG2006) Grand Final. More than 700 of the top gamers from 70 countries joined WCG2006 and experienced Apacer's outstanding Overclocking Series memory modules. Besides DDR2 1066 MHz modules, Apacer also provides DDR2 800 MHz low latency modules for gamers' lower latency requirements.

Apacer Massive Heat Spreader Features:
- Adopts a high-performance, extruded aluminum heat sink
- The front side has 3 horizontal and 24 vertical grooves cut into the aluminum heatsink. The
　 backside includes 8 horizontal grooves as well. This design greatly enlarges the heat dissipation
　 area.
- The larger size of 127 mm x 36 mm x 2 mm (Length/ Width/ Height) increases performance.
- Unique U-shaped space increases the heat dissipation area. Gamers can add a fan on these memory modules.